| Title: |
Thermal Design & Performance of a 300 mm Wafer Scale System |
| Authors: |
Colgan, Evan G.; Mann, Phillip; Schleupen, Kai |
| Source: |
2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2024 23rd IEEE Intersociety Conference on. :1-6 May, 2024 |
| Relation: |
2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) |
| Database: |
IEEE Xplore Digital Library |