| Title: |
Backside Power Delivery With Relaxed Overlay for Backside Patterning Using Extreme Wafer Thinning and Molybdenum-Filled Slit Nano Through Silicon Vias |
| Authors: |
Zhao, P.; Witters, L.; Jourdain, A.; Stucchi, M.; Jourdan, N.; Maes, J.W.; Bana, H.; Zhu, C.; Chukka, R.; Sebaai, F.; Vandersmissen, K.; Heylen, N.; Montero, D.; Wang, S.; D'Have, K.; Schleicher, F.; Vos, J.D.; Beyer, G.; Miller, A.; Beyne, E. |
| Source: |
IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 71(12):7963-7969 Dec, 2024 |
| Database: |
IEEE Xplore Digital Library |