Embedded Silicon-Germanium-Based Thermoelectric Devices on 300-mm Wafer
| Title: | Embedded Silicon-Germanium-Based Thermoelectric Devices on 300-mm Wafer |
|---|---|
| Authors: | Schwinge, C.; Hoffmann, R.; Biedermann, K.; Czernohorsky, M.; Kannan, J.; Rudolph, M.; Mende, F.; Wagner-Reetz, M.; Gerlach, G.; Weinreich, W. |
| Source: | IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 71(12):7794-7801 Dec, 2024 |
| Database: | IEEE Xplore Digital Library |