Surface Modification of Cu Films by Gas Cluster IoN Beams Using Organic Acid Vapor for Wafer Bonding
| Title: | Surface Modification of Cu Films by Gas Cluster IoN Beams Using Organic Acid Vapor for Wafer Bonding |
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| Authors: | Toyoda, N.; Takeuchi, M. |
| Source: | 2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2024 8th International Workshop on. :1-1 Oct, 2024 |
| Relation: | 2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) |
| Database: | IEEE Xplore Digital Library |