| Title: |
TEOS and Thermal Oxide Low Temperature Direct Wafer Bonding Dynamics |
| Authors: |
Michaud, L.G.; Abadie, K.; Fournel, F.; Morales, C.; Larrey, V.; Caulfied, C.; Wimplinger, M. |
| Source: |
2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2024 8th International Workshop on. :1-1 Oct, 2024 |
| Relation: |
2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) |
| Database: |
IEEE Xplore Digital Library |