| Title: |
Hydroxide and Fluoride Catalyzed Bonding Interface Closure for Low Temperature Wafer Bonding |
| Authors: |
Noel, P.; Larrey, V.; Tardif, S.; Rieutord, F.; Landru, D.; Fournel, F. |
| Source: |
2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2024 8th International Workshop on. :1-1 Oct, 2024 |
| Relation: |
2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) |
| Database: |
IEEE Xplore Digital Library |