| Title: |
Applying Hybrid Numerical Simulation of Capillary Underfill Flow to Advanced Packaging Technologies in Fine Pitch Multi-Chip Modules |
| Authors: |
Wu, Chien-Ting; Lin, Wei-Yu; Chou, Ching-Kai; Wei, Zi-Hsuan; Shen, Leo |
| Source: |
2024 19th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2024 19th International. :151-153 Oct, 2024 |
| Relation: |
2024 19th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) |
| Database: |
IEEE Xplore Digital Library |