| Title: |
System Level Heat Sink Design of Power Module for EV Application |
| Authors: |
Liu, Chun-Kai; Po-Kai, Chiu; Chiou, Shian-Chiau; Wang, Ting-Yu; Chen, Yao-Shun; Chiang, Fara; Ke, Ming-Can |
| Source: |
2024 19th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2024 19th International. :177-180 Oct, 2024 |
| Relation: |
2024 19th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) |
| Database: |
IEEE Xplore Digital Library |