Die-to-Wafer Hybrid Bonding Impact at MM-Wave Frequencies
| Title: | Die-to-Wafer Hybrid Bonding Impact at MM-Wave Frequencies |
|---|---|
| Authors: | Alsukour, Mohammad; Valorge, Olivier; Faure, Margot; Vincent, Loic; Milon, Victor; Chevalier, Pascal; Pistono, Emmanuel; Arnould, Jean-Daniel; Dubarry, Christophe |
| Source: | 2024 International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2024 International. :1-6 Sep, 2024 |
| Relation: | 2024 International 3D Systems Integration Conference (3DIC) |
| Database: | IEEE Xplore Digital Library |