| Title: |
2nm Platform Technology Featuring Energy-Efficient Nanosheet Transistors and Interconnects Co-Optimized with 3DIC for AI, HPC and Mobile SoC Applications |
| Authors: |
Yeap, Geoffrey; Lin, S.S.; Shang, H.L.; Lin, H.C.; Peng, Y.C.; Wang, M.; Wang, PW; Lin, CP; Yu, KF; Lee, WY; Chen, HK; Lin, DW; Yang, BR; Yeh, CC; Chan, CT; Kuo, JM; Liu, C-M; Chiu, TH; Wen, MC; Lee, T.L.; Chang, CY; Chen, R.; Huang, P-H; Hou, C.S.; Lin, YK; Yang, FK; Wang, J.; Fung, S.; Chen, Ryan; Lee, C.H.; Lee, TL; Chang, W.; Lee, DY; Ting, CY; Chang, T.; Huang, HC; Lin, HJ; Tseng, C.; Chang, CW; Huang, KB; Lu, YC; Chen, C-H; Chui, C.O.; Chen, KW; Tsai, MH; Chen, CC; Wu, N.; Chiang, HT; Chen, XM; Sun, SH; Tzeng, JT; Wang, K.; Peng, YC; Liao, HJ; Chen, T.; Cheng, YK; Chang, J.; Hsieh, K.; Cheng, A.; Liu, G.; Chen, A.; Lin, HT; Chiang, KC; Tsai, CW; Wang, H.; Sheu, W.; Yeh, J.; Chen, YM; Lin, CK; Wu, J.; Cao, M.; Juang, LS; Lai, F.; Ku, Y.; Jang, S.M.; Lu, L.C. |
| Source: |
2024 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2024 IEEE International. :1-4 Dec, 2024 |
| Relation: |
2024 IEEE International Electron Devices Meeting (IEDM) |
| Database: |
IEEE Xplore Digital Library |