| Title: |
Vertical GaN Devices: Reliability Challenges and Lessons Learned from Si and SiC |
| Authors: |
Meneghini, M.; Fregolent, M.; Zagni, N.; Hamadoui, Y.; Marcuzzi, A.; Favero, D.; De Santi, C.; Buffolo, M.; Tomasi, M.; Zappala, G.; Bahat-Treidel, E.; Brusaterra, E.; Brunner, F.; Hilt, O.; Huber, C.; Medjdoub, F.; Meneghesso, G.; Verzellesi, G.; Pavan, P.; Zanoni, E. |
| Source: |
2024 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2024 IEEE International. :1-4 Dec, 2024 |
| Relation: |
2024 IEEE International Electron Devices Meeting (IEDM) |
| Database: |
IEEE Xplore Digital Library |