| Title: |
Effect of Wafer Backside Thin Film Thickness on Wafer Stealth Dicing Performance |
| Authors: |
George, Nathaniel Simon; Lim, Dao Kun; Khoo, Kian Guan; Lin Jolyn, Tey Jie; Shah, Ankur Harish; Tanola, Rommel; Lu, Mei Wen; Sim, Wen How; Singh, Harjashan |
| Source: |
2024 IEEE 26th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2024 IEEE 26th. :695-699 Dec, 2024 |
| Relation: |
2024 IEEE 26th Electronics Packaging Technology Conference (EPTC) |
| Database: |
IEEE Xplore Digital Library |