Solder Ball Alloy Effect on Board Level Reliability Thermal Cycling and Vibration Test Enhancement
| Title: | Solder Ball Alloy Effect on Board Level Reliability Thermal Cycling and Vibration Test Enhancement |
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| Authors: | Chen, Fa -Chuan; Yu, Kevin; Lin, Shih-Chin; Chu, Che-Kuan; Lin, Tai-Yin; Lin, Chien-Min |
| Source: | 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2024 IEEE 26th. :790-796 Dec, 2024 |
| Relation: | 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC) |
| Database: | IEEE Xplore Digital Library |