Study of Moisture Characteristic of Epoxy Molding Compound and Hygroscopic Swelling Warpage Thru Bi-Material Sample
| Title: | Study of Moisture Characteristic of Epoxy Molding Compound and Hygroscopic Swelling Warpage Thru Bi-Material Sample |
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| Authors: | Chen, Yun-Ying; Chen, Ting-Wen; Chen, Chai-Tien; Lin, Lewis; Chung, Min; Gan, CL; Takiar, Hem |
| Source: | 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2024 IEEE 26th. :951-955 Dec, 2024 |
| Relation: | 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC) |
| Database: | IEEE Xplore Digital Library |