Low-Resistance and Thermally Stable Ohmic Contacts on n-GeSn Using Ni and Ti Metallization
| Title: | Low-Resistance and Thermally Stable Ohmic Contacts on n-GeSn Using Ni and Ti Metallization |
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| Authors: | Coudurier, N.; Quintero, A.; Pellerin, R.; Robin, M.; Hartmann, J.; Reboud, V.; Rodriguez, P. |
| Source: | IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 72(4):2065-2072 Apr, 2025 |
| Database: | IEEE Xplore Digital Library |