SiGe BiCMOS Wafer-level Packaging and Antenna Integration for sub-THz Applications
| Title: | SiGe BiCMOS Wafer-level Packaging and Antenna Integration for sub-THz Applications |
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| Authors: | Wietstruck, Matthias; Schulze, Sebastian; Kruger, Patrick; Vos, Thomas; Bashir, Muhammad F.; Wipf, Selin Tolunay; Durmaz, Emre C.; Joy, Kanaka |
| Source: | 2025 16th German Microwave Conference (GeMiC) German Microwave Conference (GeMiC), 2025 16th. :354-357 Mar, 2025 |
| Relation: | 2025 16th German Microwave Conference (GeMiC) |
| Database: | IEEE Xplore Digital Library |