UCle-Compliant Chiplet Interconnect Design Leveraging Cutting-Edge Packaging Technologies
| Title: | UCle-Compliant Chiplet Interconnect Design Leveraging Cutting-Edge Packaging Technologies |
|---|---|
| Authors: | Huang, Yu-Jie; Lin, Mu-Shan; Tsai, Chien-Chun; Chen, Wei-Chih; Kuo, Hsin-Hung; Yang, Shu-Chun; Li, Shenggao |
| Source: | 2025 IEEE Custom Integrated Circuits Conference (CICC) Custom Integrated Circuits Conference (CICC), 2025 IEEE. :1-8 Apr, 2025 |
| Relation: | 2025 IEEE Custom Integrated Circuits Conference (CICC) |
| Database: | IEEE Xplore Digital Library |