| Title: |
Predictive Validity for Sintered Die-Attach Performance Based on Cross-Sectional Morphology |
| Authors: |
Gao, Runhua; Tatsumi, Hiroaki; Kobatake, Takanori; Ueshima, Minoru; Nishikawa, Hiroshi |
| Source: |
2025 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2025 International Conference on. :169-170 Apr, 2025 |
| Relation: |
2025 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) |
| Database: |
IEEE Xplore Digital Library |