Solder Dewetting and Reliability Challenges in Microbumps Due to NCF Entrapment
| Title: | Solder Dewetting and Reliability Challenges in Microbumps Due to NCF Entrapment |
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| Authors: | Kim, J.; Lee, H.; Yu, Y.; Pyun, J. |
| Source: | IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 25(3):649-653 Sep, 2025 |
| Database: | IEEE Xplore Digital Library |