Reducing Wafer Scraps with AI: Detecting Hidden Damage in Vacuum Chambers
| Title: | Reducing Wafer Scraps with AI: Detecting Hidden Damage in Vacuum Chambers |
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| Authors: | Tsai, Canta; Lin, Sam; Chang, Rem; Lee, Chia-Yu; Yoo, Andrew; Wu, Cheng-Ying; Hsieh, Chia-Chun |
| Source: | 2025 36th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) SEMI Advanced Semiconductor Manufacturing Conference (ASMC), 2025 36th Annual. :1-4 May, 2025 |
| Relation: | 2025 36th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) |
| Database: | IEEE Xplore Digital Library |