| Title: |
Interconnect Reliability for Single-Step Sintered Die Stack |
| Authors: |
Gupta, Nikhil; Zhang, Guoqi; Quednau, Sebastian; Klengel, Sandy; Klengel, Robert; Simpson, Robin; Poelma, Rene; Liu, Nick; Fritzsche, Sebastian; Krueger, Frank |
| Source: |
2025 IEEE 75th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2025 IEEE 75th. :1529-1535 May, 2025 |
| Relation: |
2025 IEEE 75th Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |