| Title: |
Signal, Power, and Thermal Integrity Co-Design for AI Accelerator ASIC and HBM3 on Silicon Interposer 2.5D-IC Chiplet Integration |
| Authors: |
Wu, Ming-Hung; Chen, Chun-Hong; Lin, Eric; Yeh, Chi-Lou; Yang, Sheng-Fan |
| Source: |
2025 IEEE 75th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2025 IEEE 75th. :282-286 May, 2025 |
| Relation: |
2025 IEEE 75th Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |