| Title: |
Formic Acid Vapor Assisted Fluxless Tcb for Advanced Packaging- a Key Enabler for Ultrafine Pitch and High-Density Interconnects |
| Authors: |
Bajwa, Adeel; Colosimo, Tom; Muthyala, Dhiraj; Cioban, Max; Tarabulski, Matt; Wasserman, Matt; Schmidt-Lange, Michael; Chylak, Bob |
| Source: |
2025 IEEE 75th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2025 IEEE 75th. :1061-1068 May, 2025 |
| Relation: |
2025 IEEE 75th Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |