| Title: |
IR Laser Debonding for Silicon Based Temporary Carrier Systems Enabling 2.5D and 3D Chiplet Integration Processes |
| Authors: |
Urban, Peter; Chancerel, Francois; Slabbekoorn, John; Halas, Simon; Bravin, Julian; Brems, Steven; Uhrmann, Thomas; Wimplinger, Markus; Phommahaxay, Alain; Beyne, Eric |
| Source: |
2025 IEEE 75th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2025 IEEE 75th. :1843-1847 May, 2025 |
| Relation: |
2025 IEEE 75th Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |