| Title: |
Next Generation Panel Level RDL Interposer Package for High Density Interconnection |
| Authors: |
Kim, Da-Hee; Cho, Myung-Do; Ko, Young-Chan; Choi, Jae-Young; Choi, Younchan; Lee, Seok Won; Choi, Wonkyoung; Kim, Dae-Woo |
| Source: |
2025 IEEE 75th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2025 IEEE 75th. :510-514 May, 2025 |
| Relation: |
2025 IEEE 75th Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |