Morphological Microstructure Characterization and Optimisation of Nanocrystalline Copper Deposition for Fine-Pitch Hybrid Bonding Cu/SiO2 at Low Temperature
| Title: | Morphological Microstructure Characterization and Optimisation of Nanocrystalline Copper Deposition for Fine-Pitch Hybrid Bonding Cu/SiO2 at Low Temperature |
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| Authors: | Loyer, Mathieu; Maubert, Marie; Gottardi, Mathilde; Philip, Pierre-Emile; Romero, Gilles; Deloffre, Emilie; Calvo-Munoz, Maria-Luisa |
| Source: | 2025 IEEE 75th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2025 IEEE 75th. :76-82 May, 2025 |
| Relation: | 2025 IEEE 75th Electronic Components and Technology Conference (ECTC) |
| Database: | IEEE Xplore Digital Library |