Die-to-Die Bonding Development Employing Atomic Layer Deposition to Enable Heterogeneous Integration of Optoelectronic Integrated Circuits
| Title: | Die-to-Die Bonding Development Employing Atomic Layer Deposition to Enable Heterogeneous Integration of Optoelectronic Integrated Circuits |
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| Authors: | Yeo, Yi Xuan; Nair Gourikutty, Sajay Bhuvanendran; Cheemalamarri, Hemanth Kumar; Chong, Ser Choong; Wai, Eva Leong Ching; Fong, Andrew Whye Keong |
| Source: | 2025 IEEE 75th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2025 IEEE 75th. :1805-1810 May, 2025 |
| Relation: | 2025 IEEE 75th Electronic Components and Technology Conference (ECTC) |
| Database: | IEEE Xplore Digital Library |