| Title: |
Optimized TIM1 Solution for Large 2.5D HPC Packages Using Silicone Matrix Containing Liquid Metal Materials |
| Authors: |
Lin, Po-Yao; Huang, Yanling; Lai, Yen-Kun; Lin, Han-Wen; Paek, JS; Wu, Max; Zhang, Jason; Huber, Thomas |
| Source: |
2025 IEEE 75th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2025 IEEE 75th. :1075-1081 May, 2025 |
| Relation: |
2025 IEEE 75th Electronic Components and Technology Conference (ECTC) |
| Database: |
IEEE Xplore Digital Library |