| Title: |
Integration of Thermal Inkjet into Over-Molded Substrates for Lab-on-CMOS Pumping Applications |
| Authors: |
Dawes, Jacob; Estenson, Alyssa; Marun, Louis; Corrigan, George; Govyadinov, Alexander; Jebakumar, Anand; Kornilovich, Pavel; Torniainen, Erik; Johnston, Matthew L. |
| Source: |
2025 IEEE International Symposium on Circuits and Systems (ISCAS) Circuits and Systems (ISCAS), 2025 IEEE International Symposium on. :1-5 May, 2025 |
| Relation: |
2025 IEEE International Symposium on Circuits and Systems (ISCAS) |
| Database: |
IEEE Xplore Digital Library |