Reversible wafer bonding for reliable compound semiconductor processing
| Title: | Reversible wafer bonding for reliable compound semiconductor processing |
|---|---|
| Authors: | Dragoi, V.; Glinsner, T.; Mittendorfer, G.; Wimplinger, M.; Lindner, P. |
| Source: | Proceedings. International Semiconductor Conference Semiconductor conference Semiconductor Conference, 2002. CAS 2002 Proceedings. International. 2:331-334 vol.2 2002 |
| Relation: | International Semiconductor Conference |
| Database: | IEEE Xplore Digital Library |