| Title: |
Integration of Through-Dielectric-Via on Buried Power Rail and Slit Nano Through-Silicon-Via for Enhanced Backside Connectivity |
| Authors: |
Zhao, P.; Witters, L.; Stucchi, M.; Montero, D.; Vergel, N.; Georgieva, V.; Chou, B.; Devriendt, K.; Jourdan, N.; Maes, J.W.; Zhu, C.; Bana, H.; Chukka, R.; Sebaai, F.; Kenens, B.; Vandersmissen, K.; Heylen, N.; Sarkar, S.; Schleicher, F.; De Vos, J.; Beyer, G.; Beyne, E. |
| Source: |
2025 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2025 IEEE International. :1-3 Jun, 2025 |
| Relation: |
2025 IEEE International Interconnect Technology Conference (IITC) |
| Database: |
IEEE Xplore Digital Library |