| Title: |
Two-metal-level semi-damascene interconnect with variable width bottom metal at metal pitch 18-26 nm and aspect ratio 4-6 routed using fully self-aligned via |
| Authors: |
Gupta, Anshul; Wu, Chen; Renaud, Vincent; Pedreira, Olalla Varela; Lesniewska, Alicja; Kundu, Souvik; Marti, Giulio; Delie, Gilles; Okudur, Fulya Ulu; Hermans, Yannick; Decoster, Stefan; Tierno, Davide; Vrancken, Evi; Kenens, Bart; Reddy, Naveen; Mudoch, Gayle; Park, Seongho; Tokei, Zsolt |
| Source: |
2025 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2025 IEEE International. :1-3 Jun, 2025 |
| Relation: |
2025 IEEE International Interconnect Technology Conference (IITC) |
| Database: |
IEEE Xplore Digital Library |