Terahertz Topological Insulators: Breaking Barriers for Future On-Chip Wireless Communication
| Title: | Terahertz Topological Insulators: Breaking Barriers for Future On-Chip Wireless Communication |
|---|---|
| Authors: | Khodadadi, M.; Gradoni, G.; Khalily, M. |
| Source: | IEEE Communications Standards Magazine IEEE Comm. Stand. Mag. Communications Standards Magazine, IEEE. 9(4):117-126 Dec, 2025 |
| Database: | IEEE Xplore Digital Library |