| Title: |
Reducing Packaging Waste in E-commerce through IoT and SVM-Based Predictive Models |
| Authors: |
J, Nithisha; Arunfred, N.; T, Poornachandar; L, Rajeshkumar; Karunkuzhali, D.; J, Suganya |
| Source: |
2025 11th International Conference on Communication and Signal Processing (ICCSP) Communication and Signal Processing (ICCSP), 2025 11th International Conference on. :355-360 Jun, 2025 |
| Relation: |
2025 11th International Conference on Communication and Signal Processing (ICCSP) |
| Database: |
IEEE Xplore Digital Library |