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Thermal Reliability Study of GAA FeFETs Under Simulated Back-End Process Conditions via Nitrogen-Based RTA

Title: Thermal Reliability Study of GAA FeFETs Under Simulated Back-End Process Conditions via Nitrogen-Based RTA
Authors: Lai, Yu-wen; Lin, Zhe-Yu; Huang, Yi-Cheng; Chen, Chun-Chi; You, Hsin-Chiang
Source: 2025 32nd International Workshop on Active-Matrix Flatpanel Displays and Devices (AM-FPD) Active-Matrix Flatpanel Displays and Devices (AM-FPD), 2025 32nd International Workshop on. :113-116 Jul, 2025
Relation: 2025 32nd International Workshop on Active-Matrix Flatpanel Displays and Devices (AM-FPD)
Database: IEEE Xplore Digital Library