| Title: |
Investigation of Polyimide Cracking Effects in Wafer-Level Chip Scale Package on Substrate (WLCSPoS) During Component-Level and Board-Level Reliability Testing |
| Authors: |
Chen, Fa-Chuan; Yeh, Bo-Kuan; Chen, Yin-Fa; Chen, Hsin-Long; Lin, Yu-Hsing; Lin, Bing-Yeh; Lin, Chien-Min; Chu, Che-Kuan; Lin, Tai-Yin; Xu, Zhe-Cheng |
| Source: |
2025 26th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2025 26th International Conference on. :1-6 Aug, 2025 |
| Relation: |
2025 26th International Conference on Electronic Packaging Technology (ICEPT) |
| Database: |
IEEE Xplore Digital Library |