Frequency-Domain Modeling of Interconnects Based on Assemble Neural Network for 3-D Integration
| Title: | Frequency-Domain Modeling of Interconnects Based on Assemble Neural Network for 3-D Integration |
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| Authors: | Ye, Z.; Wang, D.; Zhao, W.; Lin, X.; Zhu, N.; Tang, M.; Liu, J.; Sun, L. |
| Source: | IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst. Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on. 45(5):2208-2221 May, 2026 |
| Database: | IEEE Xplore Digital Library |