| Title: |
Co-Design Framework for High Power, Medium-/High-Voltage WBG Power Modules: Case Study With 3.3-kV/200-A Wire-Bonded Low-Inductance SiC Half-Bridge Module |
| Authors: |
Li, Y.; Deng, S.; Wu, Y.; Mustafeez-Ul-Hassan, .; Xie, Y.; Basit Mirza, A.; Singh, D.; Luo, F.; Deshpande, A.; Flicker, J. |
| Source: |
IEEE Journal of Emerging and Selected Topics in Power Electronics IEEE J. Emerg. Sel. Topics Power Electron. Emerging and Selected Topics in Power Electronics, IEEE Journal of. 14(2):2463-2480 Apr, 2026 |
| Database: |
IEEE Xplore Digital Library |