| Title: |
A 28-Gb/mm2 4XX-Layer 1-Tb 3-b/Cell WF-Bonding 3D-nand Flash With 5.6-Gb/s/Pin IOs |
| Authors: |
Park, S.; Lyu, J.; Kim, M.; Lee, J.; Song, Y.; Yu, C.; Makoto, H.; Kwon, Y.; Park, J.; Kim, H.; Lee, D.; Seo, D.; Kang, P.; Go, B.; Jeon, S.; Ryu, J.; Seo, J.; Ku, H.; Jo, Y.; Kim, D.; Yoon, H.; Kim, W.; Kim, I.; Kim, S.; Cho, J.; Im, J.; Choi, Y.; Park, I.; Yoon, C.; Jang, J.; Lee, S.; Song, K.; Hur, S. |
| Source: |
IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 61(1):250-258 Jan, 2026 |
| Database: |
IEEE Xplore Digital Library |