| Title: |
New Perspective on Chiplet ESD and Dielectric Breakdown for Optimizing Protection Circuit in 2.5D/3D Bonding Technology |
| Authors: |
Lin, Shih-Hsiang; Simicic, Marko; Krilcic, Mihael; Pantano, Nicolas; Chen, Wen-Chieh; Van der Plas, Geert; Beyne, Eric; Wambacq, Piet |
| Source: |
2025 IEEE European Solid-State Electronics Research Conference (ESSERC) Solid-State Electronics Research Conference (ESSERC), 2025 IEEE European. :249-252 Sep, 2025 |
| Relation: |
2025 IEEE European Solid-State Electronics Research Conference (ESSERC) |
| Database: |
IEEE Xplore Digital Library |