| Title: |
Thermal Analysis of a 5G Telecom Demonstrator in FO-WLP SiP with Integrated Gan Power Amplifier and GaAs Low Noise Amplifier |
| Authors: |
Jakani, Anass; Jacquet, Jean-Claude; Kakou, N'Doua Luc Arnaud; Bouslama, Mohamed; Bortolussi, Vincent; Sarazin, Nicolas; Lambert, Benoit; Sommet, Raphael; Piotrowicz, Stephane; Gauthier, Gildas |
| Source: |
2025 31st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2025 31st International Workshop on. :1-5 Sep, 2025 |
| Relation: |
2025 31st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) |
| Database: |
IEEE Xplore Digital Library |