| Title: |
Thermal-Resistance-Based Reliability of TIM1 Materials in a Lidded Thermal Test Vehicle Under Active Thermal Load-Cycling |
| Authors: |
Sternberg, Maik; May, Daniel; Wargulski, Dan R.; Pareek, Kaushal Arun; Wunderle, Bernhard; Ras, Mohamad Abo |
| Source: |
2025 31st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2025 31st International Workshop on. :1-6 Sep, 2025 |
| Relation: |
2025 31st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) |
| Database: |
IEEE Xplore Digital Library |