| Title: |
Promoting EMC Adhesion to Copper Leadframe Through Oxide Thickness Optimization |
| Authors: |
Feautrier, Celine; Saudet, Benoit; Henry, David; Licitra, Christophe; Gauthier, Nicolas; Haumesser, Paul-Henri; Tan, Ky-Lim; Aytous, Hicham; Morelle, Jean-Michel |
| Source: |
2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2025 25th European. :1-5 Sep, 2025 |
| Relation: |
2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC) |
| Database: |
IEEE Xplore Digital Library |