| Title: |
Optimizing Ag Paste Thickness for Reliable Power Module Packaging |
| Authors: |
Liu, Ran; Chen, Chuantong; Liu, Yang; S., Nakayama Koji; Ueshima, Minoru; Masahiko, Nishijima; Suganuma, Katsuaki |
| Source: |
2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2025 25th European. :1-6 Sep, 2025 |
| Relation: |
2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC) |
| Database: |
IEEE Xplore Digital Library |