| Title: |
Microelectronic Packaging Challenges for Stacked Superconducting Qubit Chips Using Indium Bump Bonding |
| Authors: |
Schneider, Andreas; Koorikkat, Aswathi; Ariyathilaka, Pawala; Acharya, Narendra; Ratter, Kitti; Chidambaram, Vivek; Lipp, John D.; Reynolds, Emily E.; French, Marcus J. |
| Source: |
2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2025 25th European. :1-5 Sep, 2025 |
| Relation: |
2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC) |
| Database: |
IEEE Xplore Digital Library |