| Title: |
Flip Chip Bonding of PMUT Using Adhesives and Their Effect on Electrical Performance |
| Authors: |
Malik, Muhammad Hassan; Da, Zhou; Rocha, Rodrigo Tumolin; Xu, Chunlei; Xu, Tingzhong |
| Source: |
2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2025 25th European. :1-5 Sep, 2025 |
| Relation: |
2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC) |
| Database: |
IEEE Xplore Digital Library |