| Title: |
Microstructural Characterization for the Joining Interface of Ag@Si Composite Sinter Joining for SiC Power Device by Scanning Transmission Electron Microscopy |
| Authors: |
Nishijima, Masahiko; Liu, Yang; Nakayama, Koji. S.; Chen, Chuantong; Ueshima, Miroru; Sganuma, Katsuaki |
| Source: |
2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2025 25th European. :1-6 Sep, 2025 |
| Relation: |
2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC) |
| Database: |
IEEE Xplore Digital Library |