Impact and Control of Residual Stresses in Ceramic Packages
| Title: | Impact and Control of Residual Stresses in Ceramic Packages |
|---|---|
| Authors: | Eberstein, Markus; Kuhblank, William; Cicconi, Rita; de Ligny, Dominique; Wimpory, Robert Charles; Apel, Daniel; Boin, Mirko |
| Source: | 2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2025 25th European. :1-7 Sep, 2025 |
| Relation: | 2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC) |
| Database: | IEEE Xplore Digital Library |