| Title: |
Ag-Nodule Mediated Bonding Using Liquid Quenched Ag-Si Alloy |
| Authors: |
Nakayama, Koji S.; Nishijima, Masahiko; Zhang, Yicheng; Chen, Chuantong; Ueshima, Minoru; Suganuma, Katsuaki |
| Source: |
2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2025 25th European. :1-5 Sep, 2025 |
| Relation: |
2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC) |
| Database: |
IEEE Xplore Digital Library |