Artificial Intelligence–Based Evaluation System With Domain Adaptation for Ultrathin Wafer Detaping
| Title: | Artificial Intelligence–Based Evaluation System With Domain Adaptation for Ultrathin Wafer Detaping |
|---|---|
| Authors: | Eu Jan, G.; Wu, H.; Zhao, J.; Lin, B. |
| Source: | IEEE Transactions on Semiconductor Manufacturing IEEE Trans. Semicond. Manufact. Semiconductor Manufacturing, IEEE Transactions on. 39(1):16-27 Feb, 2026 |
| Database: | IEEE Xplore Digital Library |